We’re in the 11th hour of teardowns, literally. We’re very sleepy, so we’ll skip the song and dance and just tell you what’s inside the iPhone 6s Plus. Drumroll please... • The display assembly on the 6s Plus weighs in at 80 g—while on last year's 6 Plus, it weighed a measly 60 g. This astonishing 33% increase in weight is all because of Apple's new 3D Touch technology. That's some heavy stuff.

• The battery capacity sits at 2750 mAh; a modest 165 mAh downgrade compared to last year's 6 Plus. Despite the downgrade, Apple claims battery life will be comparable to that of the 6 Plus.

• The iPhone 6s Plus—like its iPhone 6s brethren—inherits a 7 out of 10 on the Repairability scale.

  • iPhone 6s Plus Chips: • Apple A9 APL1022 SoC + SK Hynix LPDDR4 RAM • Qualcomm MDM9635M LTE Cat. 6 Modem • TriQuint TQF6405 Power Amplifier Module • Skyworks SKY77812 Power Amplifer Module • TriQuint TQF6405 Power Amplifier Module • Skyworks SKY77812 Power Amplifer Module • Avago AFEM-8030 Power Amplifier Module • Qualcomm QFE1000 Envelope Tracking IC • SK Hynix H230DG8UD1ACS 16 GB NAND Flash • Universal Scientific Industrial 339S00043 Wi-Fi Module • NXP 66V10 NFC Controller • Apple/Dialog 338S00122 Power Management IC • Apple/Cirrus Logic 338S00105 Audio IC • Qualcomm PMD9635 Power Management IC • Skyworks SKY77357 Power Amplifier Module • Murata 240 Front-End Module • RF Micro Devices RF5150 Antenna Switch • NXP 1610A3 • Apple/Cirrus Logic 338S1285 Audio IC • Texas Instruments 65730AOP Power Management IC • Qualcomm WTR3925 Radio Frequency Transceiver • Skyworks SKY13701 WLAN Front-End Module • Texas Instruments TI 57A5KXI

These are just the teardown highlights. You can catch our full analysis at the teardown.